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Biobond

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Filters

Tensile strength (kPa)

Adhesive type

Debonding temperature (°C)

Melting temperature (°C)

Bonding time (min)

Debonding time (min)

Debonding mechanism

T-peel strength (N/cm²)

Elongation at break (%)

Hardness (ShA)

Curing temperature (°C)

Curing time (min)

BX-Bond-01

BX-Bond-01

Adhesive Type: Film

Debonding Temperature: 80 °C

Melting Temperature: 155 °C

Bonding Time: 2 min

Debonding Time: 2 min

Debonding Mechanism: Solvent

T Peel Strength: 28 N/cm²

BX-Bond-02

BX-Bond-02

Adhesive Type: Paste

Debonding Temperature: 80 °C

Melting Temperature: 140 °C

Bonding Time: 10 min

Debonding Time: 5 min

Debonding Mechanism: pH

BX-Bond-03

BX-Bond-03

Adhesive Type: Web

Debonding Temperature: 80 °C

Melting Temperature: 145 °C

Bonding Time: 2 min

Debonding Time: 2 min

Debonding Mechanism: Solvent